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The Home Page of the Finishing Industry ... In the "real world" waste disposal is a major headache for electroplating factories. But here you have only used toothpaste, vinegar, salt and sugar. The very small amount of zinc or copper you have dissolved into it is really not a significant issue.
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www.finishing.com/faqs/howworks.html
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I'm an absolute beginner in electroplating. I would like to copper some iron pieces (plate, pipe); so I've turned or filed to the desired dimension and shape. I've prepared a solution of copper sulfate [link is to product info at Amazon] CuSO4 (~200 g/l) and H2SO4 (~5 g/l) in water (deionized).
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www.finishing.com/0000-0199/064.shtml
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and electroplating copper onto the substrate. ... The present invention is directed to cyanide-free monovalent copper electroplating solutions for depositing copper onto a substrate.
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www.freepatentsonline.com/EP1009869.html
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Pulse reverse electrolysis of acid copper solutions is used for applying copper to printing cylinders, especially gravure printing cylinders. The plating composition generally comprising copper ions, counter ions, chloride ions, a polyalkylene glycol, and a bath-soluble divalent sulfur compound.
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www.freepatentsonline.com/EP1766106.html
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Special report: Celebrating 50 years of the IBM Journals - Selected paper ... The dual-damascene electroplating process, which deposits copper simultaneously in via holes and overlying line trenches, is ideally suited for the fabrication of copper chip interconnections.
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www.research.ibm.com/journal/50th/devices/andricacos.ht...
www.research.ibm.com/journal/50th/devices/andricacos.html
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Home » Directory » Electronics & Semiconductors » Semiconductors » Materials & Wafers » Copper ; Manufacturers, suppliers and providers of copper electroplating, copper materials and associated equipment.
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www.business.com/directory/electronics_and_semiconducto...
www.business.com/directory/electronics_and_semiconductors/semiconductors/materials_and_wafers/copper/weblistings.asp
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Critical issues based on the interaction between copper electroplating and chemical mechanical planarization (CMP)have been explored at Ebara. Such issues include global uniformity, local morphology variation, post CMP voids or pits, or transient changes in copper structural and compositional properties.
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www.mrs.org/s_mrs/sec_subscribe.asp?CID=2468&DID=140651...
www.mrs.org/s_mrs/sec_subscribe.asp?CID=2468&DID=140651&action=detail
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Ultra-thin platinum (Pt) films grown by atomic layer deposition (ALD) have been investigated as an alternative to conventional physical vapor deposited (PVD) Cu as seed layer for copper (Cu) electroplating.
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www.mrs.org/s_mrs/sec_subscribe.asp?CID=6467&DID=176323...
www.mrs.org/s_mrs/sec_subscribe.asp?CID=6467&DID=176323&action=detail
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Electrolytically Etching and Copper Plating Altoid Tins ... When you coat the tins with copper sulfate using a cotton swab, do you then use the electroplating method to make the copper actually plate the surface of the tin? Or does it merely attain that color simply by applying the solution? ... copper electroplating altoid tin...
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steampunkworkshop.com/altoid-etch.shtml
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