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5. The deflection circuit of claim 1, comprising a tuned circuit coupled in parallel with the vertical generator, said tuned circuit being tuned to a frequency related to operation of said horizontal generator. ... 18. The defection circuit of claim 17, comprising means for generating a composite control signal for...
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www.patentstorm.us/patents/4988927/claims.html
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An image signal display device as claimed in claim 1, wherein said first arithmetic circuit includes a first coefficient circuit for said vertical defection ...
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www.patentstorm.us/patents/5623272/claims.html
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What is claimed is: 1. A method of repairing an imager array having a vertical short circuit across an optically transmissive dielectric layer between an imbedded electrically conductive component and an optically transmissive common electrode layer overlying the imager array, comprising the steps of:
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www.freepatentsonline.com/5518956.html
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6. A deflection yoke structure according to claim 1, wherein the coefficient of the Fourier development of the winding distribution of said vertical defection coils is the same as that of said correcting coils for correcting a vertical pincushion distortion.
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www.freepatentsonline.com/6172451.html
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First line: PC1379 DESCRIPTION LINEAR INTEGRATED CIRCUIT 1-CHIP DEFECTION SYSTEM Contek PC1379 consists vertical Abstract: .. PC1379 LINEAR INTEGRATED CIRCUIT. 1. 1-CHIP DEFECTION SYSTEM.
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www.datasheetarchive.com/PC1379-datasheet.html
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4, a comparison is made with the dead zone in the vertical direction. Specifically, the vertical-direction pixel comparison unit 36 of the check circuit 22 performs a comparison check based on the data of each supplied pixel as shown in the following.
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www.faqs.org/patents/app/20080252756
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A high density solder tail connector assembly for leadless integrated circuit packages. The plastic connector package includes upper and lower header portions each having a plurality of mating terminal reception channels formed therein.
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www.patentgenius.com/patent/4188085.html
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A high density solder tail connector assembly for leadless integrated circuit packages. The plastic connector package includes upper and lower header portions each having a plurality of mating terminal reception channels ... 3,955,867. Vertical walls 87 and 89 further define the horizontal IC package receiving area 91.
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freepatentsonline.com/4188085.html
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Home | Login | Logout | Access Information | Alerts | Purchase History | Cart--> | ... With this circuit, when one route is defective and the other route is not, correct data can be automatically displayed without any additional process such as defect detecting and laser repairing. » View citation and abstract...
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ieeexplore.ieee.org/iel5/2220/4251538/04251582.pdf?arnu...
ieeexplore.ieee.org/iel5/2220/4251538/04251582.pdf?arnumber=4251582
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